PCB material composition
March 09 , 2022
The main material used to manufacture PCB (Printed Circuit Board) is very important. The properties of the material in terms of temperature resistance, adhesion, tensile strength, flexibility, dielectric strength, dielectric constant and many other physical, electrical and thermal factors must be considered. The performance and level of integration of a PCB is entirely dependent on the materials used to manufacture the PCB.
FR-4 is made of fiberglass, also known as FR4, the letters FR stand for "flame retardant". This substrate layer provides a solid foundation for the PCB, although the thickness will vary depending on the application of a given board.
Copper Clad Laminate (CCL) is a product made of wood pulp paper or glass fiber cloth as reinforcement material, impregnated with resin, single-sided or double-sided copper-clad foil, and hot pressed.
Classification criteria
Material
reinforcement
Material
PF resins (XPC, FR1, FR2)
PF resins (XPC, FR1, FR2)
Epoxy resin (FE-3)
polyester resin
Epoxy resin (FE-3)
Epoxy resin (FR4, FR5)
Composite Epoxy (CEM)
/
Laminated multi-layer base class
/
Special material base class
BT、PI、PPO、MS
flammable
Fireproof
UL94-VO、UL94-V1
Non-fireproof
UL-94-HB
CCL
performance
CCL with general performance
/
Low dielectric constant copper clad laminate
/
High heat resistant copper clad laminate
/
CCL with low thermal expansion coefficient
/
English
