PCBA for non-contact infrared thermometer

Determinants of solder-ability

May 17, 2021

In the process of PCBA processing, solder-ability directly affects the quality of the electronic product. Some inadvertent small problems can affect the solder-ability of the product. In order to avoid such problems, we must understand first.

PCBA solder-ability is actually the PCBA soldering effect, which can be summarized as 4 major factors:

1. The quality of the PCB

The manufacturing process and size design of the PCB all affect the solder-ability of the PCBA. For example, if the PCB size is too small, the soldering will be difficult to control and mutual interference will occur, so the design directly affects the soldering. How to avoid controlling the quality of incoming materials and ensuring that the supplier has done solder-ability testing to reduce this risk.

2. Solder paste

The factor of solder paste also plays a important role in the solder-ability of PCBA. Pay attention to the storage time of solder paste and defrost it after opening. After thawing, stir the solder paste again. It is best to use it up on the same day and change the solder paste frequently. Steel mesh.

3. Components

The components are assembled on the PCB. If you don’t pay attention to the storage time and environment of the components, and you don’t pay attention to avoiding damp and oxidation, it will be easy to short-circuit and crack during soldering. Also, it is to control incoming materials to test its solder-ability to ensure production. When the problem occurs.

4. Production environment

The temperature and humidity of the workshop cannot be too high or too low. High humidity will affect the solder paste to cause bridging during reflow, and excessive water absorption will cause poor aggregation. Low humidity directly affects the flux evaporation rate, causing the solder paste to dry out and affect soldering. The high temperature reduces the viscosity of the solder paste and can also cause additional oxidation of the solder and affect the solder-ability. Low temperature can cause bad printing behavior, so the temperature and humidity of the environment are also extremely important. Pay attention to the temperature and humidity of the workshop is also the key point that can determine the solder-ability factor.

Controlling these four determinants of weld-ability in the production process can effectively improve PCBA product quality.

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