About Us
About Us
About Us
About Us
11

Years of experience

About Us

Xianglong(shenzhen)
Xianglong (Shenzhen) Electronic Technology Co., Ltd. was established in 2010, with a factory area of 30,00 square meters,200 employees, located in Shenzhen, Guangdong, China. Our company is mainly engaged in the development, design, production and assembly of PCB. Our products are used in communication equipment, medical equipment, automotive electronics, smart home and security equipment. Provide customers with high-quality products , fast and on-time delivery services. And have professional technical consultant to provide you with reply on your doubt and problem at any time. We have advanced technology and equipment, from design review to manufacturing, to quality control and testing. You can rely on our professional manufacturing and sales team with more than 10 years of experience in the electronics industry to produce your products. Leave it to us. 85% of our products are sold overseas, exported to Europe, America, Asia and other countries. If you want to know more about us and what we can do to help solve your specific PCB and PCBA assembly needs, please contact us instant messenger or call (+86)0755-2322 6243 free of charge. We are warmly and patiently to communicate with you, win your business by demonstrating our capabilities, and by providing reliable, fair-cost and long-term partnerships. Hope you can become our important customer.
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The factory area
The factory area
3000
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XiangLong (Shenzhen) Electronic Technology Co., Ltd. can provides EMS, including but not limited to the following services, PCB design, PCB layout, PCB prototype, BOM fabrication , PCB inspection and PCB assembly.

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Chip out of stock!How does the PCBA factory survive and development?
Jun 07, 2021 Chip out of stock!How does the PCBA factory survive and development?
Affected by international trade competition and fluctuations in the chip industry, since the end of 2020, not only domestic chip prices have soared, but also abroad. For example: ST, ADI, TI and other well-known brand chips, without exception, doubled or even dozens of times the price, making manufacturers and many electronic product research and development companies miserable, including the PCBA factory. The chip price fluctuations this time have a wide-ranging impact. It is a bit like the mask and mask machine market before the arrival of the new crown epidemic. Many people are anxious to hoard a lot of goods and some people make a lot of money. The fundamental reason for the skyrocketing chip prices is the occurrence of supply scarcity, coupled with the international trade competition restricting chip exports. Various reasons have superimposed on this market. Since the impact is inevitable, how should PCBA manufacturers actively respond? First of all, calm down from the market turmoil, and carefully analyze the current customers to seize the orders in hand to do a good job, so that orders not affected by the chip market can run smoothly, and control the production risks of the enterprise. Secondly, analyze the internal operating costs of the enterprise, reduce unnecessary expenses and waste, and avoid rework of batch products. Go to develop some areas that are not affected by the chip market, and focus on expanding new customers.
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What is OSP?
May 26, 2021 What is OSP?
An organic solder mask is formed on the clean bare copper surface of the circuit board to protect the copper surface from oxidation, rust, heat shock, moisture resistance, and corrosion resistance. In the later soldering, flux is added and after the soldering is heated, This layer of film will evaporate, which is more convenient for welding. The thickness of OSP film is generally 0.2-0.5μm. Computer keyboard PCB and computer motherboard PCB, in many cases will choose OSP process, PCB area is relatively large, if you choose gold plating process, the cost is higher. It is estimated that 25-30% of PCBs currently use OSP, and its process control is easier than other surface treatments. If the PCB surface does not require connection functions or the storage period is too long, OSP is an ideal choice. (1). OSP Function: Protect the surface of bare copper from oxidation, rust, heat and thermal shock, moisture resistance, and corrosion resistance. (2). Advantages& disadvantages: 1). Good coplanarity, can be used on high-density PCB; 2). It can pass the RoHS standard and can be stored for 6 months in vacuum packaging (environmental temperature 15-35℃, environmental humidity RH≤60%); 3.)Lower cost than HASL 4). The surface is flat and the weld-ability is good (in the case of not being oxidized) Disadvantages: 1). OSP is transparent and colorless, it is difficult to distinguish whether OSP has been applied; 2) The OSP film surface is easy to scratch, and the storage environment requires high (keep away from acidic environment); 3). Compared with ENIG and HASL, the storage time is also shorter; (3). Process flow: Remove oil→Water washing→Micro Etching→cleaning with pure water→Pickling→cleaning with pure water→OSP→washing with pure water→drying
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A good PCBA training
May 23, 2021 A good PCBA training
May 15, 2021, in order to let our newly joined our company staffs quickly familiarize themselves with the products and better serve every customer.  Mainly explain in detail about PCBA product identification. The engineer conducts a detailed analysis with his 10 years of experience in the PCBA industry and a series of PCBA products that the company has done. How should we identify PCBA? First of all, we need to understand the role of components on the PCBA board. For example: On the PCB, character“R” represents resistance, and its main function is to step down and divide the voltage. Character “C” represents the capacitance, and its main function on the PCB is to reduce noise and stabilize the voltage. The most important thing is the chip (IC), which is the most important part of the entire PCB, equivalent to the human brain. It integrates a variety of electronic components on the PCB to achieve a specific function of the circuit module. Its function is calculation and storage. How to ensure the quality of our products? The engineer takes the bluetooth audio PCBA as an example: in order to increase the service life of the product. PCBA is a key part of the electronic product. We know that the audio is in a long-term vibration state. This will have a great impact on our chips for a long time, so that the life of the electronic products will be shortened. We can dispensing the chip to help the chip be fixed in board. If you want to know more details, please contact us! Tel: +86 0755 2322 6243 EXT 801.
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Determinants of solder-ability
May 17, 2021 Determinants of solder-ability
In the process of PCBA processing, solder-ability directly affects the quality of the electronic product. Some inadvertent small problems can affect the solder-ability of the product. In order to avoid such problems, we must understand first. PCBA solder-ability is actually the PCBA soldering effect, which can be summarized as 4 major factors: 1. The quality of the PCB The manufacturing process and size design of the PCB all affect the solder-ability of the PCBA. For example, if the PCB size is too small, the soldering will be difficult to control and mutual interference will occur, so the design directly affects the soldering. How to avoid controlling the quality of incoming materials and ensuring that the supplier has done solder-ability testing to reduce this risk. 2. Solder paste The factor of solder paste also plays a important role in the solder-ability of PCBA. Pay attention to the storage time of solder paste and defrost it after opening. After thawing, stir the solder paste again. It is best to use it up on the same day and change the solder paste frequently. Steel mesh. 3. Components The components are assembled on the PCB. If you don’t pay attention to the storage time and environment of the components, and you don’t pay attention to avoiding damp and oxidation, it will be easy to short-circuit and crack during soldering. Also, it is to control incoming materials to test its solder-ability to ensure production. When the problem occurs. 4. Production environment The temperature and humidity of the workshop cannot be too high or too low. High humidity will affect the solder paste to cause bridging during reflow, and excessive water absorption will cause poor aggregation. Low humidity directly affects the flux evaporation rate, causing the solder paste to dry out and affect soldering. The high temperature reduces the viscosity of the solder paste and can also cause additional oxidation of the solder and affect the solder-ability. Low temperature can cause bad printing behavior, so the temperature and humidity of the environment are also extremely important. Pay attention to the temperature and humidity of the workshop is also the key point that can determine the solder-ability factor. Controlling these four determinants of weld-ability in the production process can effectively improve PCBA product quality.
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What is ENIG?
Apr 23, 2021 What is ENIG?
ENIG full name is Electroless Nickel/Immersion Gold(some people call Chemical nickel gold, immersion nickel gold and soft gold) It is a continuous layer of nickel-gold alloy deposited on the surface of copper through redox reaction, a process of applying solderable coating on the bare copper surface of the PCB, which makes the PCB have better electrical conductivity and prolongs the service life of the PCB. Sometimes the cost of this surface treatment process will account for 20% of the cost of the printed circuit board. In actual production applications, 90% of the gold plates use the process of ENIG. After this process, the color of the PCB surface is stable to golden yellow,the brightness is good, the plating layer is flat, and the thickness of the surface treatment as the pad is generally 0.03µ - 0.08 µ. In the same way, gold finger PCB is made. Compared with the Gold Plating process, the gold finger of ENIG is not wear-resistant.If you do not often plug and unplug the Golden finger , you can also choose ENIG Process. At present, about 10%-20% of PCBs surface treatment use ENIG. The first choice for the button PCB, suitable for the edge connection area of the router shell and the electrical contact area for elastic connection of the chip processor, high-precision PCB with bonding IC, or BGA design. (1)Functions: ENIG makes the welding surface flat and can be well welded. Compared with Gold Plating, it has a lower cost and can prevent corrosion on the exposed copper surface. (2)Advantage: a). PCB surface is flat, good coplanarity b). The solderability is good, and the soldering of the components is stronger (over reflow soldering will not affect its solderability) c). It is not easy to be oxidized and anti-corrosion, so that the PCB can be stored for a longer time (3)Disadvantage: a). Compared with Gold Plating, the ENIG process is not wear-resistant b). Compared with the OSP process, the ENIG process is complicated General ENIG process: Acid cleaning→micro-etching→pre-dipping→activation→electroless nickel plating→chemical immersion gold. Comparison of ENIG and Plating Gold: Outward Appearance Solderability Antioxidant capacity Solder mask Binding force Plating Gold Bias towards white ★★ ★★★ ★★ ENIG Bias towards yellow ★★★ ★★★★★★ ★★★
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