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About Us
About Us
11

Years of experience

About Us

Xianglong(shenzhen)
Xianglong (Shenzhen) Electronic Technology Co., Ltd. was established in 2010, with a factory area of 30,000 square meters,200 employees, located in Shenzhen, Guangdong, China. Our company is mainly engaged in the development, design, production and assembly of PCB. Our products are used in communication equipment, medical equipment, automotive electronics, smart home and security equipment. Provide customers with high-quality products , fast and on-time delivery services. And have professional technical consultant to provide you with reply on your doubt and problem at any time. We have advanced technology and equipment, from design review to manufacturing, to quality control and testing. You can rely on our professional manufacturing and sales team with more than 10 years of experience in the electronics industry to produce your products. Leave it to us. 85% of our products are sold overseas, exported to Europe, America, Asia and other countries. If you want to know more about us and what we can do to help solve your specific PCB and PCBA assembly needs, please contact us instant messenger or call (+86)0755-2322 6243 free of charge. We are warmly and patiently to communicate with you, win your business by demonstrating our capabilities, and by providing reliable, fair-cost and long-term partnerships. Hope you can become our important customer.
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More than
More than
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Export to The World
Export to The World
200
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The factory area
The factory area
3000
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XiangLong (Shenzhen) Electronic Technology Co., Ltd. can provides EMS, including but not limited to the following services, PCB design, PCB layout, PCB prototype, BOM fabrication , PCB inspection and PCB assembly.

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Hot-air solder leveling
Apr 09, 2021 Hot-air solder leveling
A process in which lead-tin solder is applied (melted) on the surface of the PCB, and the lead-tin solder is blown flat with heated compressed air. (In the dynamic environment of high temperature and high pressure, the PCB is immersed in the lead-tin solder (melted), and the air knife will flatten the liquid solder on the copper surface) The hot air leveling process is relatively dirty, smells bad, and is relatively dangerous, and the technical control is relatively complicated. If the flatness is not good, it will affect the welding quality of the components. With the advancement of technology, a hot air leveling process suitable for assembling QFP and BGA with a smaller pitch has also emerged. In actual applications, OSP and ENIG are both selected. At present, in PCB surface treatment, 20% -40% will use hot air leveling, let us understand its advantages and disadvantages together. (1). Function: The lead-tin solder (melted) forms a layer of anti-copper oxidation coating, slows the oxidation of copper, and forms a copper-tin metal compound (about 1 to 2 mils in thickness) at the junction with copper, providing good solder-ability. (2). Advantages and disadvantages of hot air leveling: Advantage: a) Low cost, good solder-ability b) Avoid corrosion disconnection on the printed board Disadvantages: a) Poor surface flatness b) The PCB is prone to warp due to large thermal shock. (3). General process Micro-etching→preheating→coating flux→spraying tin→cleaning. Tin spray is divided into lead-free spray tin (lead content less than 0.1) and lead spray tin (lead content 37%), the difference between them:   Lead-free Lead Cost low lower(relative to lead-free) Mechanical strength medium High (relative to lead-free) Brightness dim bright (relative to lead-free) RoHS can pass Can’t pass
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How to inspect PCBA incoming materials?
Mar 25, 2021 How to inspect PCBA incoming materials?
The empty PCB board assembles various electronic components on the circuit board through SMT, and then forms PCBA through DIP plug-in. Among them, the incoming components are in the SMT inspection process. We need to check whether the labels and model specifications of the incoming materials are consistent. Use a magnifying glass to check whether the physical model specifications and silk-screen logos are consistent. Check the structure and shape after the model and silk-screen are no problem. It is consistent with the drawings and samples in the acknowledgment. Refer to the drawings and use a vernier to measure the size of the chip capacitors to meet the requirements. We need to use a digital bridge (LCR METER) tester to select DCR for testing. The capacity should be within the required range when measuring the capacity, and the loss value should be recorded while measuring the capacity, and the value should be within the required range. After passing the above inspections, the chip capacitors can be placed in the machine for placement, the components are soldered on the PCB board through the placement machine (SMT), manual welding (DIP, AI) and other equipment methods. A wide variety of chip capacitors is just one of them. It is a component that can store charges, and the same component has different dielectric specifications, and different specifications have different characteristics and uses. There are also diodes, tertiary tubes, and stickers. Chip resistors, various IC chips, relays, transformers, etc., they play their due role on the PCBA. If you want to know more about the detailed inspection standards of PCBA components, please call us: +86 0755 2322 6243 EXT 801. info@xlpcba.com+86 0755-2322 6243 EXT
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The Computer Motherboard PCB Assemble
Jun 05, 2020 The Computer Motherboard PCB Assemble
How do we assemble the computer motherboard PCB? Put the produced PCB on the SMT automated production line, put a steel mesh on the automatic paste brushing machine, after the automatic paste brushing machine, it will brush a layer of solder paste on the corresponding position of the computer motherboard PCB, high-speed machine (similar to Intelligent robot) Assemble rice-sized capacitors and resistors on the computer motherboard PCB. The general-purpose machine attaches IO sound card chips, network card chips, power management chips, south bridge, north bridge chips, field effect transistors and other components to the PCB, although it is There are robots, but there will still be skilled operators operating and checking on the line. QC strictly supervises and checks the quality in accordance with the ISO9001 standard to ensure that the components will not be installed incorrectly or missed or installed incorrectly, and flow into the reflow furnace. This process will solder all the previously attached components. After that, it will be inspected by automatic optical inspection machine (AOI) and ICT, mainly for appearance inspection. Whether the stickers are reversed or crooked, the pictures taken are checked against the database to ensure that each component is completely correct. Whether the circuit function is normal. The inspected qualified products will be sent to the DIP production workshop. The DIP production line is filled with fixtures. This is used to fix the computer motherboard PCBA. Skilled operators will install relatively large memory slots, PCI slots, and AGPs on it. Slots, various interfaces, audio connectors and other components, after completion, perform ICT testing (can the motherboard be lit, whether the function is normal), we also call FQC testing, if it is a qualified product, it can be packed in an anti-static bag. Packaging standard: the keyboard and mouse interface is facing right, and the sealing is to the welding surface. Put it in the box together with the accessories, and the box will be pulled to the warehouse. If it fails, it will be repaired or scrapped directly. Please give us the authorization letter before signing the PCBA contract for manufacturing computer motherboards. We will strictly follow the quality requirements and manufacturing standards specified in the contract to manufacture and deliver on time. If you want to know more about the PCB manufacturing and assembly services provided by Xianglong (Shenzhen) Electronic Technology Co., Ltd. for computer motherboard PCBA and computer peripheral products, please call +86 0755 2322 6243 EXT 801. You can also email your specifications to info@xlpcba.com
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FPC Market Prospects And Trends
Aug 28, 2020 FPC Market Prospects And Trends
Flexible printed circuit boards have the characteristics of light weight and thin thickness. Compared with rigid printed circuit boards, it can save up to 60% of space and weight. In addition, the benefits provided in terms of durability and cost further expand their adoption rates in different end-use industries. At present, FPC has been widely used in mobile smart terminals such as smart phones, tablet computers, and wearable devices. It is the only solution to meet the needs of miniaturization and convenient movement of electronic products. In recent years, the flexible PCB market technology has undergone major changes from the traditional single-sided flexible circuit to the advanced multilayer flexible circuit board. The rise of rigid-flex circuit technology is creating great potential in various telecommunications and medical applications, and driving the demand for flexible PCB technology. In the flexible PCB market, various technologies such as single-sided, double-sided, multilayer and rigid flexible circuits are used in various applications. The growing demand for FPC in the telecommunications industry, the growth of connected devices and the advancement of automotive electronics technology have created new opportunities for various flexible PCB technologies.
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What is PCB?
Oct 08, 2020 What is PCB?
PCB, as the "mother of electronic products", is a bridge that carries electronic components and connects circuits. It is widely used in communications, consumer electronics, computers, automotive electronics, industrial control, medical equipment, national defense, aerospace and other fields. It is a modern electronics indispensable electronic components in information products. It is a provider of electrical connections for electronic components. The downstream of the PCB industry covers almost all electrical circuit products, and the core applications with the largest output value include communication equipment, computers, consumer electronics and automotive electronics. With the development of electrification and automation in human society, the application range of PCB is becoming wider and wider, and there are no other substitutes for the time being. 1. Classification according to the strength of PCB substrate (1) Rigid printed boards Printed boards made of rigid substrates; (2) Flexible printed boards Printed boards made of flexible substrates, also known as flexible printed boards; (3) Rigid and flexible printed boards are printed boards made by using flexible substrates and combining them with rigid substrates in different areas. 2. Classification according to the method of making conductive patterns on PCB circuit boards (1) Subtractive PCB Printed circuit boards made by subtractive technology; (2)Additive PCB Printed circuit boards produced by the additive process. 3. According to the PCB circuit board substrate classification (1)Organic printed boards. Conventional printed boards are all organic printed boards, which are mainly composed of three materials: resin, reinforcing materials and copper foil. Resin materials include phenolic resin, epoxy resin, polyimide, /A resin, etc.; (2)Inorganic printed boards are commonly referred to as thick film circuits, which are composed of ceramics, metal aluminum and other materials. Inorganic printed boards are widely used in high-frequency electronic instruments. 4. Classification according to the conductive structure of the PCB circuit board (1)Single-sided printed circuit board refers to a printed circuit board with conductive patterns on only one side. Because the wires only appear on one side, this kind of printed circuit board is called a single-sided printed circuit board. (Referred to as single panel) (2)A printed board with conductive patterns on both sides of the double-sided printed board, because the area of the double-sided board is twice as large as that of the single-sided board, and the wiring can be staggered (it can be wound to the other side), which is more suitable for more complex On the circuit. (3)Multi-layer printed board A printed board made of 3 or more layers of conductive patterns and insulating materials alternately bonded together and laminated, referred to as a multilayer board, requires the conductive patterns between layers to be connected to each other as needed...
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